Manufacture Ability

AUTO
AUTO
Capacity Section
Monthly Capacity
AXIAL 3
EYELET 2
RADIAL 7
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5,000K Points
SMT
SMT
Capacity Section
Monthly Capacity
23 LINES
C/SOLDER : 18
BONDING : 5
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550,000K Points
PBA
PBA
Capacity Section
Monthly Capacity
13 LINES
Factory1 : 5 LINES
Factory2 : 8 LINES
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SET TOP BOX = 950K Sets
SMPS = 250K Sets
SUB PBA = 100K Sets
FULLSET
FULLSET
Capacity Section
Monthly Capacity
STB / Wi-fi 12 Lines
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SET TOP BOX : 600K Sets
Wi-fi / CPE : 100K Sets
Electric Meter : 200K Sets
REMOCON : 150K Sets
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Mobile Phone 20 Lines
Mobile Sub Assembly = 550K Sets

Equipment for Production

CHIP MOUNTER : SAMSUNG SM471

As a high performance chip shooter that applies two gantries equipped with 10 spindles per head as well as new flying vision, the SM471 realizes a chip mounting speed of 75,000 CPH, the highest in the world among chip shooters of the same class. In addition, it is applicable to 0402 chips to the largest

  • 75,000 CPH
  • 2 Gantry x 10 Spindle/Head
  • Applicable Parts : 0402

Equipment for Production

Multi-Functional Placer : SM482

As a high performance Multi-Functional Placer that applies one gantries equipped with 6 spindles per head as well as new flying vision, the SM482 realizes a IC mounting speed of 30,000 CPH, the highest in the world among IC shooters of the same class

  • 30,000 CPH
  • 1 Gantry x 6 Spindle/Head
  • Applicable Parts : 0402

Equipment for Production

SCREEN PRINTER : SAMSUNG SP1

High Performance Screen Printer

  • Alignment Accuracy : ±12.5μm@6σ
  • Print Cycle Time : 5seconds (Excluding printing time)
  • Applicable PCB (LxW) : 330mm x 250mm
  • SPI feedback function
  • Automatic mask changing/setting/leveling functions
  • Various operational convenience

REFLOW : TSM & HELLER

High performance & quality reflow. 

New design to minimize nitrogen consumption and related running cost.
High performance PPM control system.
Heater & Fans offer even Convection Heat on BGA/CSP process.
Selective Heating Zone allows wide variation of profile setting.
Heat sealed cover design enhances energy saving & performance.
Nitrogen Reflow

The Best Technology Reflow

Pure Forced Convection Heating
350° Operating Temperatures
Lead-Free processing capability
New Flux Management System
Programmable Cooling
Nitrogen Reflow

Inspection

X-RAY
X-RAY
X-RAY : XAVIS
SPI
SPI
SPI : PARMI
AOI
AOI
AOI : MIRTEC
Vacuum Packing
Vacuum Packing
VACUUM PACKING : AIRZERO
BAKING
BAKING
BAKING : JEIOTECH
WI-FI TEMP CONTROL
WI-FI TEMP CONTROL
WI-FI TEMP CONTROL : TFA DOSTMANN

Warehouse Space

F/G W/H : 150K sets

Raw material W/H : 200K sets

The Best Way to Success.

It’s with Samindo, the Finest EMS Company

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