Manufacture Ability

AUTO

Capacity Section

Monthly Capacity

AXIAL 3
EYELET 2
RADIAL 7
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5,000K Points

SMT

Capacity Section

Monthly Capacity

23 LINES
C/SOLDER : 18
BONDING : 5
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550,000K Points

PBA

Capacity Section

Monthly Capacity

13 LINES
Factory1 : 5 LINES
Factory2 : 8 LINES
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SET TOP BOX = 950K Sets
SMPS = 250K Sets
SUB PBA = 100K Sets

FULLSET

Capacity Section

Monthly Capacity

STB / Wi-fi 12 Lines
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SET TOP BOX : 600K Sets
Wi-fi / CPE : 100K Sets
Electric Meter : 200K Sets
REMOCON : 150K Sets
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Mobile Phone 20 Lines
Mobile Sub Assembly = 550K Sets

Equipment for Production

CHIP MOUNTER : SAMSUNG SM471

As a high performance chip shooter that applies two gantries equipped with 10 spindles per head as well as new flying vision, the SM471 realizes a chip mounting speed of 75,000 CPH, the highest in the world among chip shooters of the same class. In addition, it is applicable to 0402 chips to the largest

75,000 CPH
2 Gantry x 10 Spindle/Head
Applicable Parts : 0402

Equipment for Production

Multi-Functional Placer : SM482

As a high performance Multi-Functional Placer that applies one gantries equipped with 6 spindles per head as well as new flying vision, the SM482 realizes a IC mounting speed of 30,000 CPH, the highest in the world among IC shooters of the same class

30,000 CPH
1 Gantry x 6 Spindle/Head
Applicable Parts : 0402

Equipment for Production

SCREEN PRINTER : SAMSUNG SP1

High Performance Screen Printer

Alignment Accuracy : ±12.5μm@6σ
Print Cycle Time : 5seconds (Excluding printing time)
Applicable PCB (LxW) : 330mm x 250mm
SPI feedback function
Automatic mask changing/setting/leveling functions
Various operational convenience

REFLOW : TSM & HELLER

High performance & quality reflow.

New design to minimize nitrogen consumption and related running cost.
High performance PPM control system.
Heater & Fans offer even Convection Heat on BGA/CSP process.
Selective Heating Zone allows wide variation of profile setting.
Heat sealed cover design enhances energy saving & performance.
Nitrogen Reflow

The Best Technology Reflow

Pure Forced Convection Heating
350° Operating Temperatures
Lead-Free processing capability
New Flux Management System
Programmable Cooling
Nitrogen Reflow